John Hong
Stanford, CA


I am an artisan of design and engineering at the junction of hardware and software. Guided by a human-centered approach, I solve challenges through a lens that places people at the heart of innovation.

Hardware
Software
Snap-Fit AirPods Case

Additive Manufacturing
April — May 2022
Stanford, CA
We all know dropping an AirPods case means disaster. My teammates and I, sharing this sentiment, designed a snap-fit cover for the AirPods case to prevent AirPods from flying out upon dropping. The Tough2000 outer case (grey) protects from the outside and TPU inner case (black) protects from the inside. We used Fusion360 (CAD, simulation), back-of-the-envelope analyses, Formlabs Form 3, Ultimaker, and a few drop tests to aid our process.

The given timeframe for this project was 3 weeks, and we were required to incorporate at least one mechanism (snap-fit) and two additive manufacturing processes (FDM, SLA).